Description
“From intelligent design to advanced packaging and testing, towards a smarter world!” From September 15th to 17th, 2022, ELEXCON & Embedded System Expo will continue to break new grounds and achieve new progress at Shenzhen Exhibition & Convention Center! ELECON2022 will not only make effort to build four major themed pavilions:”Semiconductor & Components Brands Pavilion”、”Power & Energy Storage Technology Pavilion”、”Embedded and AIoT Technology Pavilion”、”SiP & Micro Assembly Pavilion”, but also bring together high-quality global brand manufacturers to share the most cutting-edge technologies: 5G/RF technology, Auto Chip & Components, MEMS/sensors, PD fast charging technology, third-generation semiconductors, shared charging and swapping, RISC-V, AI technology, industrial computers, IoT solution, laser/dispensing technology, EDA, packaging and testing equipment, advanced materials, etc. At the same time, over 200 experts from all over the world are invited to submit their contributions on the latest research and developments in this field.
EXHIBITION SECTORS
Semiconductor Components /5G /Automotive Grade Semiconductor Components
Semiconductor, 5G Technology, Auto Chip & Components, Connector/Switch, MEMS/Sensors, Distributor/E-commerce
Power & Energy Storage
Power Management, Power Devices, Third-Generation Semiconductors, PD Fast Charging Technology, Battery, Energy Storage , Power Supply Test
Embedded & AIoT
Embedded Processor/MCU, RISC-V, Storage Pavilion, AI Technology, Industrial Computer/Board/Industrial Display, IoT Solution Zone
SiP & Advanced Packaging and Testing/South China Semiconductor Manufacturing & Packaging and Testing
OSAT, 3D IC design/EDA/IP tools, Semiconductor equipment and advanced technology, Semiconductor material application, Wafer-level SiP advanced production line demo, Mini-LED packaging technology
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